MultiMetrixs LM Wafer Mapping Sensors:
the answer to your wafer handling needs
Improve the reliability and throughput of your robotic wafer handling systems
with the next generation wafer mapping sensors from MultiMetrixs.
LM reflective sensors help control the position of the wafer at different stages
in the chip making process. With a sensing distance of more than 5 feet and
resolution down to 10 micron, the LM sensors will handle the majority of applications
related to the wafer alignment and mapping. LM wafer mapping sensors are the most
technically advanced and cost effective solution on the market today.
Multi-Dimensional Distance Detection
MultiMetrixs LM sensors eliminate the distance constraints
of old sensor technology.
Faster more flexible automation routines can be designed using LM
sensors without sacrificing accuracy or reliability from 2" to 20" .
Map Any Wafer
Existing sensor technology has difficulty mapping low reflective
surfaces, particularly blue nitride.
Multimetrixs patented laser technology detects ANY surface so
all wafers are mapped, preventing production glitches caused by missed wafers.
Detect All Wafer Misplacements
Conventional wafer mapping sensors cannot recognize all wafer misplacements.
LM sensors prevent system stoppages and expensive crashes by identifying
ALL wafer misplacements - stacked, cross-slotted and empty slots.
MultiMetrixs LM sensors work in any FOUP environment and performance
is not affected by secondary reflections from within the enclosure.
LM sensors are also completely immune to environmental light
flashes (including sunlight).
Plug and Play Compatible
Guarantied compatibility with all semiconductor industry standards for wafer
mapping software and robotic hardware.
LM sensors can be added to a system in minutes with
Superior Price Performance
LM wafer mapping sensors offer the best price performance in the industry.
Cost effective, LED parallel wafer address sensor
Ideal for one shot mapping of a wafer's positions in a cassette.
The LTB-PW can determine the position all of the wafers in
a cassette within 15 ms.
The unit will work with wafer sizes from 4 to 12 inches and wafer
thickness of 300 to 1000 micron.
Also detects cross-slotted wafers with any steps from 1/4 to 3/16 inches.