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MultiMetrixs Through Beam Sensors:
            cost-effective wafer positioning control


These low cost precision thru-beam sensors are specially designed for wafer mapping, aligning and positioning. They are designed to prevent production line stoppages and expensive crashes by identifying ALL wafer misplacements - stacked, cross-slotted and empty slots.

MultiMetrixs’ thru-beam sensors can control the position of the wafer at different stages in the chip making process. They will handle the majority of applications related to the wafer mapping and alignment and could be integrated into any wafer handling tool such as FOUP opener, vacuum end-effector, electrical edge gripper, etc.

LTB-01
Precision long range LED through beam sensor

Accurately detects any kind of wafer in a cassette or on a pre-aligner table.  The sensing range is up to 1.5 meters (5 feet) and the unit will detect wafer thicknesses from 200 to 1000 microns.

TB-150/200/300
Reliable laser through beam sensors

Class 1 laser based thru-beam sensors are designed to handle the majority of applications related to wafer mapping, aligning and positioning. They will prevent ALL wafer misplacements - stacked, cross-slotted and empty slots.

 TB-150/200/300 are highly reliable sensors that could be easily integrated into any wafer-handling tool such as FOUP opener, vacuum end-effector, electrical edge gripper, etc.

LTB-M
Long range LED combined wafer-mapping sensor

LTB-M can reliably detect any wafer (including cross-slots) in a cassette, by moving a very tiny (6x6x3 mm) sensor installed on the robot arm and a string of LED source lights installed from the back side of the cassette.
Key Features
Reliability

Long Range

Cost Effective

Plug and Play Compatible

Precission Allignment and Mapping


TB-300

PDF Documents

 TB-150/200/300 Spec Sheet
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