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MultiMetrixs Edge Grippers:
                      Optional Features Overview

MultiMetrixs IEGs can be configured to include a self-centering mechanism, which simultaneously moves the three gripping tips toward wafer center for holding, or away from wafer center releasing.  This unique feature greatly reduces the numbers of particles generated during picking and placing of wafers, as it prevents them from sliding in a cassette or boat.  In addition, the self-centering mechanism dramatically improves wafer placement accuracy, reduces wafer positioning time and allows for wafer misalignment of up to 5 mm.

IEGs can be configured to lift wafers from the top, while holding the wafer 0.5mm from its edge.  It allows simplification of wafer handling in some processes (e.g. picking of hot wafer with increased sagging)  while elimitating the necessity of lifting pins on OEM equipment.

Thru-beam mapping
MultiMetrixs has developed laser Class 1 thru-beam sensors that are easily integrated into its family of intelligent grippers.  U-shape and Spade-type IEGs can be equipped with thru-beam for mapping in the FOUP or cassette.  The top-approach IEG can be equipped with thru-beam to define wafer´s elevation for safe picking.

Rotating distal gripping tips
Rotating distal gripping tips can be incorporated into any 300 mm edge gripper to allow random access into small pitch cassette, boat or any narrow gates.

Leveling posts and adapter plate
For simple mounting and horizontal leveling of grippers, MultiMetrixs offers a variety of leveling posts and custom adapter plates tailored for any specific application and host robot´s mounting bracket.
Key Benefits
Cleanest edge gripper on the market

No back-side contamination

Handles wafers with notch or flat

Multiple wafer handling (up to 5)

Significant cost savings

Proven flexibility

Higher through-put

Fast turn-around time

PDF Documents

 IEG 200 Fact Sheet

 IEG 300 Fact Sheet

 Cleanliness Report

 Electrical vs. pneumatical
      edge grippers
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