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Products Overview Products Solutions
MultiMetrixs Edge Grippers:           for 300mm Wafers
Intelligent Wafer Gripping System
  • Flexible confuguration
  • Simple integration with any robot
  • Sommunications via:
    • RS-232, RS-485, CAN, and others
  • Easy to teach
  • High speed
  • Cleanliness - ISO Class 1
Basic Gripper IEG-300 and IEG-300D
  • Self-centering to prevent wafer shift
  • Safe-locking to secure wafers during EMO
  • Soft touch to prevent particle creation
  • Programmable grip force: 2 to 12N
  • Electrically actuated
  • Fast gripping: < 0.3 sec
  • Light weight: 490 grams
Model IEG-300D is a dual-gripper configuration
Gripper with Side Thrubeam IEG-300T
  • Integrated Laser Class 1 Driver
  • Capable to map compressed pitch: < 5 mm
  • Power: 24V at 250mW
  • Communications via RS-232, RS-485, CAN, and others
Self-Centering U-Shape Gripper IEG-300US
  • Safe-locking
  • Soft touch
  • Programmable gripping force: 2 to 10N
  • Electrically Actuated
  • Fast gripping: < 0.3 sec
  • Optional Class 1 Laser Thrubeam
  • Light weight: 550 gram
Basic U-Shape Gripper for 200/300mm IEG-300U
  • Safe-locking
  • Soft touch
  • Programmable gripping force: 2 to 12N
  • Electrically Actuated
  • Modular design
  • Capable to map with compressed pitch: < 8mm
  • Fast gripping: < 0.3 sec
  • Optional Class 1 Laser Thrubeam
Basic U-Shape Modular Gripper IEG-300UH
  • 6-axis High Speed Application
  • Safe-locking
  • Soft touch
  • Electrically Actuated
  • Easily replaceable blade
  • Mechanism box weight: < 400 gram
  • Optional Class 1 Laser Thrubeam


U-Shape Self-centering Gripper IEG-300HH
  • Top approach
  • Hot wafers: < 250°C
  • Optional Class 1 Laser Thrubeam for:
    • mapping in cassette and process boat
    • wafer elevation determination
Top Approach with Thrubeam and Vacuum Pad Gripper IEG-300TV
  • Uniquely designed for wafer metrological equipment
  • Supports use of small OD calibration wafers: 50-200mm
  • Simplifies wafer chuck by eliminating lifting pins

U-Shape Gripper IEG-300UD
  • Safe-locking
  • Soft touch
  • Carbon-fiber blade
  • Programmable gripping force: 2 to 12N
  • Electrically Actuated
  • Modular design
  • Capable to map with compressed pitch: < 8mm
  • Fast gripping: < 0.3 sec
  • Optional Class 1 Laser Thrubeam
  • Optional Could be used for dual-wrist application
Self-centering Gripper with Side Thrubeam IEG-300CT
  • Integrated Laser Class 1 Driver
  • Capable to map compressed pitch: < 5 mm
  • Power: 24V at 250mW
  • Communications via RS-232, RS-485, CAN, and others
Self-centering Gripper IEG-300C
  • Integrated Laser Class 1 Driver
  • Capable to map compressed pitch: < 5 mm
  • Power: 24V at 250mW
  • Communications via RS-232, RS-485, CAN, and others
Key Benefits
Cleanest edge gripper on the market

No back-side contamination

Handles wafers with notch or flat

Multiple wafer handling (up to 5)

Significant cost savings

Proven flexibility

Higher through-put

Fast turn-around time
PDF Documents

 IEG 300 Fact Sheet

 Cleanliness Report

 Electrical vs. pneumatical
      edge grippers
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